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Comparison ledger

DTG 8460 TaikoversusDTG 8460 Wafer Backside

Disco DTG 8460 Taiko, Disco DTG 8460 Wafer Backside, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DTG 8460Disco DTG 8460
Cited variants
  • DTG 8460 Wafer Backside[1]
—
Specifications
Configuration3 Chucks[2]Includes DTU 1550[5]
Phase200-2008 V, 50 A, 50/60 Hz, 3 Phase[2]—
Voltage208 V[3]—
Wafer size12 inch[2]12 inch[5]
Process typeCassette to Cassette[2]—
Number of chucks3[2]—
Current50 A[2]—
Frequency50/60 Hz[2]—
Add-on chillerDTU 1531[2]—
AccessoriesUSV, Duct Unit, Vacuum Unit[2]—
Vintage year2012[4]—
Chuck table for 12—, and 8" is possible[5]
Each spindle has 2 height gauge—inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[5]
Machine type—Wafer backside grinder[5]
Accessory—Includes DTU 1550[5]
Chuck table—For 12", and 8" is possible[5]
Robot picker—For 12", and 8" is possible[5]
Spinner table—For 12", and 8" is possible[5]
Height gauge—Each spindle has 2 height gauge: inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]tarasemi.comtarasemi.com
  5. [5]inventory listing