Waferpedia

Comparison ledger

1034versusMT8589

Electroglas 1034, Multitest MT8589, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1034Electroglas
MT8589Multitest
OEMElectroglasMultitest
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run—2000–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyElectroglas 1034Multitest MT8589
Specifications
Type—Gravity Handler[1]
Contact site—dual contact site[1]
Temperature range—tri-temp from -55 to 155 °C[1]
Conversion time—kitable; simple conversion in 10 to 15 min.[1]
Maximum throughput—4,800 uph[1]
Package types—250 different package types (DIP, SO, TO, PLCC)[1]
Contacting—standard to high power Kelvin[1]
Installed base—more than 2,000 systems[1]
Device size—5 mm to 60 mm device length; width up to 40 mm; pitch down to 0.65 mm[1]
Interface—SECS-GEM Interface[1]
Device spectrum—high power contact spring[1]
Contact sites—Dual contact site[1]
Supported package families—DIP, SO, TO, PLCC[1]
Device pitch—Down to 0.65 mm[1]
Device length—5 mm to 60 mm[1]
Device width—Up to 40 mm[1]
Applications—Automotive power devices, consumer electronics, logic and analog[1]
Contact type—Standard to high power Kelvin[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org