Waferpedia

Comparison ledger

1007versusNextest Magnum II X SSV

KLA 1007, Teradyne Nextest Magnum II X SSV, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1007KLA
OEMKLATeradyne
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA 1007Teradyne Nextest Magnum
Specifications
ManufacturerKLA[1]—
Model1007[1]Magnum II X SSV[4]
DescriptionWafer Prober[1]—
Wafer size150 mm[1]—
Convertible to 8 inch wafer sizeYes[1]—
Vintage01.06.1995[1]—
MakeKLA[2]Teradyne / Nextest[4]
Equipment typeProber[2]—
Test head—4 Chassis[3]
Configuration—HSB 3 (qty 16)[3]
DBM Size—18(2) GBIT[3]
ECRM Size—72(4) GBIT[3]
RCM Size—36(2) Mbit[3]
Test head chassis—4[3]
HSB 3 quantity—16[3]
PE63 quantity—64[3]
DP3X quantity—64[3]
IPC quantity—4[3]
Total channels—4096[3]
DPO quantity—4[3]
Tester computer—Dell T3500[3]
Operating system—Windows Server 2003[3]
HSB—3 (qty 16)[3]
PE63—(qty 64)[3]
DP3X—(qty 64)[3]
IPC—(qty 4)[3]
DPO—(qty 4)[3]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing