Comparison ledger
KLA Candela CS 20 V Surface Analyzer, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100R16Strasbaugh | |
|---|---|---|
| OEM | KLA | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | 2" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Candela CS 20 | Strasbaugh 100R16 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Violet Laser (405nm, 25mW)[1] | — |
| Phase | Laser: 405 nm, 25 mW diode - Spot size: 5 × 6 µm Detection modes: - Scattered light - Specular reflection - Phase shift - Surface topography[2] | — |
| Wafer size | Wafer Handling: - Sizes: 2", 3", 4", 5", 6", 8" - Thickness: 0.2–1.1 mm - Automatic robotic transfer - Cassette-to-cassette operation[2] | — |
| Laser wavelength | 405 nm[2] | — |
| Laser power | 25 mW[2] | — |
| Spot size | 5 × 6 µm[2] | — |
| Detection modes | Scattered light, specular reflection, phase shift, surface topography[2] | — |
| Wafer sizes supported | 2", 3", 4", 5", 6", 8"[2] | — |
| Wafer thickness range | 0.2–1.1 mm[2] | — |
| Particle detection threshold | 0.08 µm (PSL equivalent)[2] | — |
| Particle detection rate | ≥95% on polished wafers[2] | — |
| Scratch detection dimensions | Length: 100 µm, Width: 0.1 µm, Depth: 50 Å[2] | — |
| Pit/Bump detection dimensions | Diameter: 20 µm, Depth: 50 Å[2] | — |
| Stain detection dimensions | Diameter: 20 µm, Film thickness: 10 Å[2] | — |
| Topography vertical resolution | 1 Å[2] | — |
| Wafer handling | Automatic robotic transfer, cassette-to-cassette[2] | — |
| Operating system | Windows XP[3] | — |
| Power supply | 230 VAC 50/60 Hz[3] | — |
| Cleanroom environment | Internal class 10[3] | — |
| Wafer sizes | 2", 3", 4", 5", 6", 8"[2] | — |
| Particle detection minimum size | 0.08 µm (PSL equivalent)[2] | — |
| Particle detection rate (polished wafers) | ≥95%[2] | — |
| Scratch detection minimum length | 100 µm[2] | — |
| Scratch detection minimum width | 0.1 µm[2] | — |
| Scratch detection minimum depth | 50 Å[2] | — |
| Pit/Bump detection minimum diameter | 20 µm[2] | — |
| Pit/Bump detection minimum depth | 50 Å[2] | — |
| Stain detection minimum diameter | 20 µm[2] | — |
| Stain detection minimum film thickness | 10 Å[2] | — |
| Vintage | 2012[1] | — |
| Make | KLA[1] | — |
| Model | Candela CS 20 V[1] | — |
| Laser | 405 nm, 25 mW diode[2] | — |
| Particle detection | Down to 0.08 µm (PSL equivalent); ≥95% detection rate (on polished wafers)[2] | — |
| Vertical resolution | 1 Å[2] | — |
| Control system | Windows XP operating system[3] | — |
| type | — | 1 spindle grinder/polisher[4] |
| drive system | — | DC drive system with 2 motors[4] |
| spindle RPM | — | 1-180 RPM[4] |
| eccentric RPM | — | 1-90 RPM[4] |
| controls | — | digital timer; air down switch; spindle and eccentric speed dials; air regulators[4] |
| capacity | — | 16 inches[4] |
| spindle size | — | 1-8 TPI[4] |
| overall dimensions | — | 28 inches x 36 inches x 48 inches[4] |
| weight | — | 500 lbs[4] |
| origin | — | made in the USA[4] |