Waferpedia

Comparison ledger

15 Lapperversus100R16

Lapmaster 15 Lapper, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
100R16Strasbaugh
OEMLapmasterStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Strasbaugh 100R16
Specifications
Number Of Conditioning RingsUp to 3[1]—
Ring IDUp to 5.5″[1]—
Plate Diameter – Outside15″[1]—
Plate Diameter – Inside3 1/2″[1]—
Standard RPM60[1]—
Drive Motor1/2 HP[1]—
Electrics110V / 1Ph / 60Hz[1]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[1]—
ConfigurationEquipped with:[1]—
Equipped with: 15″ Cast Iron PlateIncluded[1]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[1]—
Equipped with: (3) Conditioning RingsIncluded[1]—
Equipped with: (3) Hold DownsIncluded[1]—
Equipped with: 30 Minute TimerIncluded[1]—
type—1 spindle grinder/polisher[2]
drive system—DC drive system with 2 motors[2]
spindle RPM—1-180 RPM[2]
eccentric RPM—1-90 RPM[2]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[2]
capacity—16 inches[2]
spindle size—1-8 TPI[2]
overall dimensions—28 inches x 36 inches x 48 inches[2]
weight—500 lbs[2]
origin—made in the USA[2]

Plan your fab

Building a CMP process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]excelltechnology.comexcelltechnology.com