Waferpedia

Comparison ledger

Orbis Alphaversus980

memsstar Orbis Alpha, Tegal 980, side by side. Every value shown is drawn from the cited encyclopedia entries.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
Orbis Alphamemsstar
980Tegal
OEMmemsstarTegal
CategoryEtchEtch
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Familymemsstar Orbis AlphaTegal 980
Cited variants—
Specifications
System typeoxide etch system[2]Single wafer cassette-to-cassette etch system[1]
Process chemistryhydrogen fluoride etchants[2]—
Footprintsmall footprint[2]—
Dimensions600 x 540 x 900 mm[2]—
ControlPC controlled[2]—
User interfaceresistive touch screen[2]Touchscreen graphical user interface[1]
Selectivity to silicon nitride and silicon dioxide< 5% 1σ[2]—
Uniformity< 5% 1σ[2]—
Repeatability< 5% 1σ[2]—
Endpoint capabilityunique endpoint capability[2]—
Substrate size rangesample sizes to 200 mm[2]—
Selectivity (silicon nitride and silicon dioxide)excellent (<5% 1σ)[2]—
Uniformity and repeatability<5% 1σ[2]—
Control interfacePC controlled with resistive touch screen[2]—
Endpoint detectionunique endpoint capability[2]—
Process windowlarge process window to optimize process for any structure[2]—
Series name—980 ACS Series[1]
Process type—Plasma etch[1]
Wafer size—200mm[1]
Throughput—Faster throughput[1]
Calibration—Faster system calibration[1]
Data handling—Integrated data logging[1]
Factory automation—Factory automation support[1]
Tool format—Single wafer cassette-to-cassette etch system[1]
System calibration—Faster system calibration[1]
Automation—Factory automation support[1]
Orbis Alpha entry980 entryAsk about these tools →Share experience with this comparison →

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]pnf.uchicago.edupnf.uchicago.edu