Waferpedia

Comparison ledger

RC 8 MS 3 Spinversus1000FP

SUSS MicroTec RC 8 MS 3 Spin, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
RC 8 MS 3 SpinSUSS MicroTec
OEMSUSS MicroTecYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec RC 8 MS 3 SpinYES 1000FP
Specifications
Frequency50 Hz[1]—
Voltage220 V[1]—
ConfigurationWith controller[1]—
Does not include add-ons (exedge bead removal / dispense and autoclean)[1]—
TypeSpin coater[1]—
Vintage2001[2]—
ControllerWith controller[1]—
High Gyrset3, 5 and 8[2]—
Air4-9 bar[2]—
Vacuum-0.6 bar[2]—
System type—Plasma cleaning system[3]
Line—R-Series Plasma Cleaning Systems (Glen Technologies)[3]
Model—Glen/YES 1000FP[3]
Designed use—Designed to accept a range of shelf sizes[3]
Application focus—Changing needs of the flat panel industry[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]web.archive.orgweb.archive.org