Comparison ledger
Tegal 1512e, Ulvac NE 950, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1512eTegal | NE 950Ulvac |
|---|---|---|
| OEM | Tegal | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 1512e | Ulvac NE 950 |
| Cited variants | — | |
| Specifications | ||
| Tool type | Industrial RIE plasma etcher system[2] | ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch) system[4] |
| Stated configuration | With modules assembly for CI-4222[2] | — |
| Manufacturer | — | Ulvac[3] |
| Model | — | NE 950[3] |
| Category | — | Etch[4] |
| Wafer description | — | chamber described for 2" to 12" wafers[4] |
| Process type | — | ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch)[4] |
| Wafer size | — | 2" to 12" wafers[4] |
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