Besi 2200

Models in this family

1. 

   2200 APM

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   2200 APM+	—	2004	Listed with 3 Phase - 400V - 50/60 Hz and DA 300 Module included.	Equipment inventory listing[1]

2. 2200 APM Die Attach Flip Chip

   The Besi / Datacon 2200 APM is a die attach / flip chip machine.

3. 

   2200 APM Multi-Chip
4. 

   2200 APM+ Die Attach

   The Besi / Datacon 2200 APM+ is a die attach machine.

5. 

   2200 EVO

   The Besi Datacon 2200 EVO is a high-accuracy multi-chip die bonder for die attach and flip chip applications.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Datacon 2200 evo plus	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com[2]
   Datacon 2200 evo hF	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com[2]
   Datacon 2200 evo hS	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com[2]
   Datacon 2200 evo advanced	—	—	New gantry & controller system, new vision and camera generation. X/Y placement accuracy: ±3 µm @ 3s, theta accuracy: ±0.07° @ 3s, bond force: 0.5N to 25N closed loop, die attach size: 0.15 mm - 30 mm, flip chip size: 0.5 mm - 30 mm. UV curing with up to 2,000 mW/cm² (365/405 nm).	besi.com[3]

6. 

   2200 EVO Die Sorters and Attachers
7. 

   2200 EVO Flexible Multi-Chip

   The Besi 2200 EVO Flexible Multi-Chip is a packaging and bonding die bonder configured with a wafer table.

8. 

   2200 EVO Multi-Chip

   The Besi / Datacon 2200 EVO Multi-Chip is a dual-head die sorter.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Besi / Datacon 2200 EVO Multi-Chip Die Sorter	—	2016	One source states dual head; another source states dual head and 2016 Vintage.	Equipment inventory listing[4]

9. 

   2200 EVO Plus

   The Besi 2200 EVO Plus is a die bonder for multi module attach and die attach or flip chip applications.

Sources