Tool family
Disco Dicing Saw.
Disco dicing saw handles up to 8 inch substrates and is used for dicing silicon, bonded Si wafers, and glasses.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DAD3220 | — | — | Automatic dicing saw with auto-alignment, auto-focus, auto-kerf check, 4 cutting channels with 320 degree max rotating angle, cutting blades thickness 100-400 micron, max substrate size 6” wafers or 6”x6” substrates, 160mm x 162mm cutting range, <0.005/160 positioning accuracy, 1.5 kW spindle at 30,000 per minute. | ece.utoronto.ca[1] |