Esec Datacon 2200 evo hF

Models in this family

1. Datacon 2200 evo hF3rd generation

   The Esec Datacon 2200 evo hF is a die bonder on Besi's 3rd-generation 300 mm high-speed platform. The Esec Datacon 2200 evo hF is specified for epoxy die attach applications and supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Datacon 2200 evo	3rd generation	—	—	besi.com[1]
   Datacon 2200 evo plus	—	—	—	besi.com[1]
   Datacon 2200 evo hS	—	—	—	besi.com[1]
   Datacon 2200 evo advanced	—	—	—	besi.com[1]

Sources