Waferpedia

Tool family

Esec Esec 2100 hS

The Esec 2100 hS is a 3rd generation 300 mm high-speed die bonder platform for epoxy die attach applications.

Models in this family

  1. Esec 2100 hS3rd generation

    The Esec 2100 hS is a 3rd generation 300 mm high-speed die bonder platform for epoxy die attach applications.