Plasma-Therm Versaline

Models in this family

1. 

   Versaline

   The Plasma-Therm Versaline is a semiconductor processing platform used for plasma-enhanced chemical vapor deposition (PECVD) and deep reactive-ion etching (DRIE), configured for 4-inch wafers.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Versaline PECVD	—	—	Identified as Plasma-Enhanced Chemical Vapor Deposition.	Equipment inventory listing[1]
   Versaline CVD	—	—	Listed as a CVD system with 3 Chamber Deposition, PCVD Versaline Chambers (x2), HDP-CVD Versaline Chamber, PM Modules (x3), Brooks MX 600, HDD, Versaline Software, and Manuals.	Equipment inventory listing[2]
   Plasmatherm Versaline CVD	—	—	3-chamber configuration with 2 PCVD Versaline chambers and 1 HDP-CVD Versaline chamber, plus 3 PM modules and Brooks MX 600 handler	Equipment inventory listing[2]
   Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)	—	—	Configured for deep silicon etching using alternate gas technique similar to Bosch process	snfguide.stanford.edu[3]
   Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)	—	—	Configured for etching silicon oxide and deep glass/quartz	snfguide.stanford.edu[3]
   Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL)	—	—	Configured for etching metals and metal-based compounds with volatile bi-products	snfguide.stanford.edu[3]

2. 

   Versaline LACVD

   The Plasma-Therm Versaline LACVD is an etch system for 6-inch wafers.

3. 

   Versaline VCX 600 ICP

   The Plasma-Therm Versaline VCX 600 ICP is a 6-inch inductively coupled plasma etch system.

4. 

   Versaline VLN ICP

   The Plasma-Therm Versaline VLN ICP is an inductively coupled plasma etcher.

Sources