Waferpedia

Tool family

Ulvac NE 950

UlvacEtch3 entries

Models in this family

  1. The Ulvac NE 950 is an ICP-RIE etch system with a chamber described for 2" to 12" wafers.

    Cited variants

    DesignationGenerationVintageChangesSource
    NE 950 EX ICP———waferpedia.com[1]
    NE 950 ICP-RIE———waferpedia.com[1]
  2. The Ulvac NE 950 EX ICP is an inductively coupled plasma etcher.

  3. The Ulvac NE 950 is an ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch) system with a chamber described for 2" to 12" wafers.

All entries

  1. NE 950Ulvac

    The Ulvac NE 950 is an ICP-RIE etch system with a chamber described for 2" to 12" wafers.

    CategoryEtch
    7 specs
  2. NE 950 EX ICPUlvac

    The Ulvac NE 950 EX ICP is an inductively coupled plasma etcher.

    CategoryEtchWaferWafer end effector
    9 specs
  3. NE 950 ICP-RIEUlvac

    The Ulvac NE 950 is an ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch) system with a chamber described for 2" to 12" wafers.

    CategoryEtch
    20 specs

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com