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6 entries
The F&K Delvotec G 5 62000 is a wire bonder described as running with 25 µm wire and a ball/wedge bondhead.
The F&K Delvotec Wedge 5430 is a die bonder used in semiconductor packaging and bonding applications.
The F&K Delvotec 2017 S is a wire bonder used in semiconductor packaging and bonding applications.
The F&K Delvotec 5432 Automatic Wedge is an automatic wedge bonder in the Packaging & Bonding category.
The F&K Delvotec G 4 6400 Deep Access is a bonder.