Applied Materials
Centura DPS+
The Applied Materials Centura DPS+ is an etch system for 200 mm (8 inch) wafers. The Applied Materials Centura DPS+ is configured with multiple process chambers, including DPS+ ES DTCU and HR DTCU chambers.[1][2]
What it is
General reference — not yet source-verifiedThe Applied Materials Centura DPS+ is a cluster-platform plasma etch system built on the Centura platform, which integrates multiple process chambers around a central wafer-handling robot.
Where it fits in the process flow
General reference — not yet source-verifiedThe Centura DPS+ is used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) semiconductor manufacturing steps. The system typically follows photolithography and precedes cleaning and metrology. The platform can etch multiple material layers in a single cluster, reducing wafer handling.
Applications
General reference — not yet source-verifiedThe Centura DPS+ is applied in etching of dielectric films such as silicon oxide and silicon nitride, as well as metal layers including aluminum and tungsten. The system is used in the fabrication of memory and logic devices.
What do the numbers mean?
Wafer handling1
Configuration & options10
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura DPS | — | — | Identified in the sources as a Centura DPS Etcher; one source notes chambers only, no loadport, with 9 chambers listed as 4 incomplete but okay condition and 5 parts. | Equipment inventory listing[3] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What are the typical throughput and cycle time for this class of etch system?General reference — not yet source-verified
Throughput and cycle time depend on the specific configuration of process chambers, wafer handling speed, and etch recipe conditions. In cluster tools of this class, multiple chambers can run simultaneously, and the central robot minimizes wafer transfer time, allowing high overall throughput for a given process.
Can the Centura DPS+ be configured for different applications beyond dielectric etch?General reference — not yet source-verified
While the DPS+ chamber is primarily designed for dielectric etch, the Centura platform itself can host chambers for various processes, including deposition and other etch types. However, the DPS+ chamber's design is optimized for dielectric etching, and its performance characteristics may not be suitable for metal or silicon etch without modification.
Not publicly documented
The following facts about the Centura DPS+ are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura DPS+ are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Centura DPS+ are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura DPS+ are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura DPS+ is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura DPS+ are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]Inventory photo
Last updated Oct 2, 2026.
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