Applied Materials
Centura DPS Poly
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedThe Applied Materials Centura DPS Poly Etch is a semiconductor fabrication tool designed for etching polysilicon layers on silicon wafers.
How it works
The tool can operate in continuous wave or synchronous pulsed RF mode. Pulsed RF operation introduces off-cycles during which etch byproducts are pumped away, reducing local gas depletion at the bottom of deep features.[2]
Chamber sidewall materials such as alumina or yttria (Y2O3) coatings are used to manage interactions with fluorocarbon or chlorine-based plasmas. A seasoning or conditioning step deposits a stable fluoropolymer layer on the chamber walls after wet cleaning to stabilize etch rates.[2]
Where it fits in the process flow
General reference — not yet source-verifiedThe Centura DPS Poly Etch is used in the front-end-of-line (FEOL) process flow for etching polysilicon gates and other polycrystalline silicon features on silicon wafers.
The tool processes wafers after deposition of the polysilicon layer and before subsequent dielectric deposition or metallization steps.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- CD deviation due to ESC thermal pad degradation
- RF matching network slow response causing plasma instability
- Micro-arcing defects
What do the numbers mean?
Power & electrical1
Wafer handling1
Optics & imaging1
Configuration & options3
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura DPS II | DPS II | — | Redesigned source coil geometry and top cover for improved plasma uniformity on 300mm wafers; upgraded gas distribution system and more flexible RF pulse function. | chinsortech.com[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- RF Pulsing Frequency1 kHz to 5 kHz[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Centura DPS Poly are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura DPS Poly are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Centura DPS Poly are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Centura DPS Poly is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura DPS Poly are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Centura DPS Poly are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]chinsortech.com — chinsortech.comchinsortech.com
Last updated Sep 23, 2026.
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