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Applied Materials

Centura eMAX CT+

EtchApplied Materials Centura eMAX CT+ family
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Applied Materials Centura eMAX CT+ is an etch chamber for semiconductor manufacturing.[1][2]

Centura eMAX CT+ — Inventory photo
Fig. 01Centura eMAX CT+Inventory photo[2]

What it is

The Applied Materials Centura eMAX CT+ is an etch system within the Centura platform. The Centura eMAX CT+ is a model of etch chamber or etcher produced by Applied Materials. The Centura eMAX CT+ is a legacy semiconductor manufacturing tool used for plasma-based etching processes.[1][2]

How it works

General reference — not yet source-verified

The Centura eMAX CT+ is a plasma etch system, meaning it uses an ionized gas, or plasma, to remove material from a silicon wafer. Plasma etch systems of this class are typically configured as cluster tools, where the etch chamber is attached to a central wafer-handling platform. The Centura platform is a well-known cluster architecture that transfers wafers under vacuum between process chambers.

Where it fits in the process flow

General reference — not yet source-verified

Etch systems of this class are used in semiconductor fabrication to define patterns after photolithography by removing dielectric or metal layers. The etch step is an intermediate process module, preceded by film deposition and photolithography, and followed by photoresist strip and cleaning. The Centura eMAX CT+ is one chamber configuration within a Centura cluster, which can perform multiple process steps in sequence without breaking vacuum.

Applications

General reference — not yet source-verified

Plasma etch systems of this type are used for etching a variety of thin films, including dielectrics and metals, during integrated circuit production. The Centura eMAX CT+ is designed for use in semiconductor manufacturing, particularly in front-end-of-line and back-end-of-line process flows. The ability to integrate multiple chambers on a cluster tool supports multi-step etch sequences and other vacuum-integrated processes.

What do the numbers mean?

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Field notes

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Not publicly documented

The following facts about the Centura eMAX CT+ are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No specifications for the Centura eMAX CT+ are on record.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura eMAX CT+ are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Centura eMAX CT+ are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Centura eMAX CT+ are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Centura eMAX CT+ are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Inventory photo
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Last updated Oct 6, 2026.

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