Applied Materials
Centura II
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedAn etch tool removes selected material from a wafer surface by exposing it to a controlled plasma or reactive process environment through a chambered process module.
Dry etch systems of this class typically use process chambers and gas chemistries chosen for the material being removed, while the tool hardware controls the sequence, timing, and uniformity of exposure.
Where it fits in the process flow
General reference — not yet source-verifiedThe Centura II fits in the wafer pattern-transfer sequence as a material-removal step used after masking or other pattern-definition steps.
An etch module sits between pattern creation and later device completion steps, because the etched features define the transferred geometry in the film stack.
Applications
The Centura II is tied to dry etch use for poly, metal, and oxide applications.[5]
What do the numbers mean?
Wafer handling2
Configuration & options8
- DPS + Metal[3]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura II | — | — | Listed with configuration option DPS + Metal. | waferpedia.com[4] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of etch processes can this class of machine perform?General reference — not yet source-verified
Such cluster-tool etch systems can be configured for dielectric etch (e.g., oxide, nitride), conductor etch (e.g., polysilicon, metals like aluminum and copper), and lightly doped drain etch, among others. The specific capability depends on the chamber modules installed and the process chemistries supported.
What are common maintenance or reliability considerations for such etch equipment?General reference — not yet source-verified
Regular preventive maintenance includes cleaning of chamber walls and electrodes to remove etch byproducts, replacement of consumable parts such as O-rings and dielectric windows, and calibration of mass flow controllers and RF generators. Chamber matching across modules in the same cluster is important for uniform process results, and software-based health monitoring helps predict component wear.
Not publicly documented
The following facts about the Centura II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura II are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Centura II are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura II are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura II is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura II are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]inventory listing
- [4]waferpedia.com — waferpedia.comwaferpedia.com
- [5]semistarcorp.com — semistarcorp.comsemistarcorp.com
Last updated Oct 10, 2026.
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