Applied Materials
Provisional entry — research in progress
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An etch system removes selected material from a wafer by directing a controlled plasma or reactive process at patterned surfaces.
A chambered etch platform supports repeated processing in a controlled vacuum environment, with loadlocks used to move wafers into and out of the process region while limiting exposure to ambient air.
An etch tool sits in the pattern-transfer portion of the fab flow after lithography has defined the mask pattern on the wafer.
The etch step transfers the pattern into underlying films or substrate layers before subsequent clean, deposition, or inspection steps.
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The following facts about the Centura Super E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura Super E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura Super E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura Super E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura Super E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura Super E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 10, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.