Applied Materials
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An etch tool removes selected material from a workpiece after a pattern has been defined by earlier lithography steps.
A plasma etch system typically uses a controlled gas environment and electrical power to generate reactive species that attack exposed material on the wafer surface.
The Applied Materials DPS 2 AE Mesa sits in the etch portion of the wafer fabrication flow.[3]
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The following facts about the DPS 2 AE Mesa are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DPS 2 AE Mesa are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DPS 2 AE Mesa are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DPS 2 AE Mesa are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DPS 2 AE Mesa are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DPS 2 AE Mesa is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.