Applied Materials
Endura 2
Plate 01#Amat endura II xp robot overhaul exchange repair applied material pvd buffer robot 300mm pvd
wafer robot repair overhaul Brooks Kawasaki rorzeWatch on YouTube
What it is
How it works
The Endura 2 uses an XP robot for wafer handling within the mainframe. The system can be configured with multiple Impulse PVD chambers and DMD chambers. A dedicated pump is included. The mainframe is an Endura II with Front Interface Version 5.3. The system has a power rating of 208 VAC/480 VAC and a loading configuration with three TDK loadports. The software version is 2.10_692.[1][2]
Where it fits in the process flow
Applications
The Endura 2 is applied to liner, barrier, and metal deposition in semiconductor manufacturing.[1][8][14][9]
- Liner / Barrier
- Metal Deposition
- Front-End Metallization
- Aluminum Interconnect
What do the numbers mean?
Vacuum & pumping3
- Dedicated Pump[1]
Wafer handling7
Control & software3
- Front Interface Version 5.3[2]
Configuration & options23
- Liner / Barrier[1]
- Metal Deposition[1]
- 3 Loadports[1]
- Liner/Barrier[8]
- Front-End[2]
- Endura II Mainframe[2]
- Can be fully refurbished with HDD replacement and reconfigured[2]
- Front-End Metallization[9]
- Aluminum Interconnect[3]
- Ell Mf[3]
- STD Blades[3]
- 3 Ch[10]
- W 3CH, DMD 2CH[11]
- Chamber Configuration
- 3 Impulse PVD chambers (Chambers 1-3), 2 DMD chambers (Chambers E and F)[2]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Perkin Elmer 4400— Same function class: Deposition, nullCompare in depthsource[12]
- CHA Mark 50— Same function class: Deposition, nullCompare in depthsource[13]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Endura 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Endura 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Endura 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Endura 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Endura 2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Endura 2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (14)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]inventory listing
- [9]inventory listing
- [10]inventory listing
- [11]inventory listing
- [12]Applied Materials, Inc. - Breaking the 65nm Barrier — appliedmaterials.com (Oct 16, 2004)web.archive.org
- [13]cnf.cornell.educnf.cornell.edu
- [14]Equipment inventory listing
Last updated Sep 22, 2026.
Compare with similar tools
View all →
The Perkin Elmer 4400 is a sputtering system used for physical vapor deposition on 6-inch wafers.
The CHA Mark 50 is a physical vapor deposition (PVD) system for thin-film deposition, capable of handling 6-inch wafers.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.