Applied Materials
Endura 5500 IMP
What it is
The Applied Materials Endura 5500 IMP is a physical vapor deposition (PVD) system used for depositing thin metal films onto semiconductor wafers.[1][2]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe Endura 5500 IMP is used in the metallization stage of semiconductor fabrication, typically after contact or via etch and before chemical-mechanical planarization (CMP) or dielectric deposition.
The tool deposits barrier and liner layers (such as titanium and titanium nitride) in advanced interconnect structures, and can also deposit metal seed layers for subsequent electroplating or chemical vapor deposition processes.
Applications
General reference — not yet source-verifiedThe system is also used for depositing other metal films where enhanced step coverage is required, such as in high-aspect-ratio contacts and vias.
What do the numbers mean?
Power & electrical4
- Electrical:[1]
Vacuum & pumping4
- CTI 9600 Cryo compressor (2)[1]
Wafer handling5
Control & software5
- No SMIF Interface2 x OD[1]
Configuration & options27
- PCII (2)[1]
- IMP TiN (2)[1]
- IMP Ti[1]
- Neslab chiller[1]
- Gen racks (2)[1]
- AC Box (2)[1]
- System Information:[1]
- Chamber A (Pre-Clean Chambers)[1]
- Chamber B (Cool Down Chamber)[1]
- Chamber C[1]
- Chamber D[1]
- Chamber E (Degas/Orienter Chamber)[1]
- PCII (2); IMP TiN (2); IMP Ti; Neslab chiller; Gen racks (2); AC Box (2)[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- CHA Mark 50— Same function class: Deposition, nullCompare in depthsource[3]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Endura 5500 IMP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Endura 5500 IMP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Endura 5500 IMP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Endura 5500 IMP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Endura 5500 IMP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Endura 5500 IMP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]cnf.cornell.educnf.cornell.edu
Last updated Oct 5, 2026.
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