Applied Materials
Mirra 3400
The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing. The Mirra 3400 supports multiple technologies including oxide, STI, tungsten, and copper CMP, as well as polyimide and amorphous silicon materials.[1]
What it is
General reference — not yet source-verifiedThe Applied Materials Mirra 3400 is a chemical mechanical polisher used for semiconductor wafer planarization.
How it works
General reference — not yet source-verifiedA chemical mechanical polisher removes material from a wafer by combining a rotating platen, a polishing head, slurry delivery, and a pad conditioner.
Where it fits in the process flow
General reference — not yet source-verifiedThe Mirra 3400 sits in the wafer-finishing portion of semiconductor manufacturing, after patterning steps that create topography and before later integration steps that benefit from a planar surface.
Applications
General reference — not yet source-verifiedThe Mirra 3400 is used for chemical mechanical polishing of semiconductor wafers.
What do the numbers mean?
Power & electrical3
Vacuum & pumping3
Wafer handling5
Gas & chemistry6
Control & software9
Configuration & options27
- Stand-Alone Oxide/STI CMP[5]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Mirra 3400 Stand-Alone | — | 1996 | Stand-alone configuration for Oxide/STI CMP, includes wet-in-wet-out handling and specific options such as TITAN1 UPA, DDF3 pad conditioner, and Windows NT control. | fabsurplus.com[5] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- GigaMat 3806 L— Same function class: CMP, UnknownCompare in depthsource[6]
- Lapmaster 72— Same function class: CMP, nullCompare in depthsource[7]
- Lam Research IPEC 472— Same function class: CMP, nullCompare in depthsource[8]
- Nova V 2600— Same function class: CMP, nullCompare in depthsource[9]
- Lam Research IPEC AvantGaard 776— Same function class: CMP, nullCompare in depthsource[10]
- SUSS MicroTec PA 300 Control— Same function class: CMP, nullCompare in depthsource[11]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Slurry DeliveryRotary pump (6)[3]
- Slurry ConfigurationAB, AB w/ Position Sensor[3]
- Slurry Delivery Arm TypeExtended w/ 4 Outputs[3]
- UPA SupplyNitrogen Gas[3]
- Min / Max Slurry Flow15 - 400 ml/mn[3]
- Min / Max Head pressure0.7 - 14 psi[3]
- Slurry flow rate range15 – 400 ml/min[3]
- Head pressure range0.7 – 14 psi[3]
- Electrical requirements200/208 VAC, 200 A, 45 kVA[1]
- Min/Max slurry flow15 - 400 ml/min[3]
- Line voltage200/208 VAC[5]
- Line frequency50 Hz[5]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the primary purpose of a CMP system in semiconductor manufacturing?General reference — not yet source-verified
The primary purpose is to planarize (flatten) wafer surfaces after deposition or etching steps, enabling precise lithographic patterning and ensuring uniform layer thickness for subsequent processes.
How does a CMP system control material removal rate?General reference — not yet source-verified
Removal rate is controlled by adjusting process parameters including platen and carrier rotational speeds, downforce pressure, slurry composition and flow rate, as well as pad conditioning frequency and pressure.
What are common defects that CMP systems must minimize?General reference — not yet source-verified
Common defects include scratches, dishing (excessive removal in patterned areas), erosion (thinning of features), micro-scratches, and residual slurry particles. Proper process tuning and post-CMP cleaning are critical to minimize these.
Is the Mirra 3400 a single-wafer or batch processing system?General reference — not yet source-verified
Machines of the Mirra class are generally single-wafer systems, processing one wafer at a time through multiple polishing heads and stations, allowing independent control of each wafer's process conditions.
What types of slurries are typically used in CMP?General reference — not yet source-verified
Slurries are formulated according to the material being polished. For example, oxide CMP uses colloidal silica slurries, while copper CMP employs slurries with complex chemical inhibitors and abrasive particles. The choice of slurry directly affects removal rate, selectivity, and defectivity.
Not publicly documented
The following facts about the Mirra 3400 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the Mirra 3400 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Mirra 3400 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Mirra 3400 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Mirra 3400 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Mirra 3400 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (11)Every fact above is drawn from these public sources
- [1]smtnet.com — smtnet.comsmtnet.com
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Inventory photo
- [5]fabsurplus.com — fabsurplus.comfabsurplus.com
- [6]Equipment inventory listing
- [7]libertymachinery.comlibertymachinery.com
- [8]Equipment inventory listing
- [9]waferpedia.comwaferpedia.com
- [10]waferpedia.comwaferpedia.com
- [11]waferpedia.comwaferpedia.com
Last updated Oct 3, 2026.
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