Waferpedia

Applied Materials

Oasis

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Oasis — Inventory photo
Fig. 01OasisInventory photo[1]

What it is

Applied Materials Oasis is a wet clean semiconductor processing system.[1]

How it works

General reference — not yet source-verified

A wet processing tool removes contaminants from wafer surfaces by exposing the wafers to liquid chemistries and rinse steps.

A wet clean system typically uses controlled chemical baths, sprays, or single-wafer liquid delivery to dissolve particles, organic residues, and other process byproducts, followed by drying.

Where it fits in the process flow

General reference — not yet source-verified

Wet cleaning sits in the wafer fabrication flow as a preparation step between process modules and before subsequent surface-sensitive operations.

Wet clean equipment is used after fabrication steps that leave residues or particles and before downstream steps that require a clean wafer surface.

Applications

The Oasis is used for semiconductor wafer cleaning on twelve-inch wafers.[1]

What do the numbers mean?

Wafer handling1

Wafer size
12 inch (300mm)[1]
Accurate?

Configuration & options1

Vintage year
2006[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the Oasis are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the Oasis are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Oasis are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Oasis are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Oasis are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Oasis are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Inventory photo
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Last updated Oct 7, 2026.

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