Waferpedia

Applied Materials

P 5000 Cluster

P 5000 Cluster — Inventory photo
Fig. 01P 5000 ClusterInventory photo[1]
  • Plate 01AMAT P5000 PECVD Nitride 2 Chambers

    Gerard Oliver DunneWatch on YouTube

Wafer size

100mm

Power

Power supplies[1]

Vacuum

Pump stand[1]

Optics

Optical endpoint detection[2]

What it is

The Applied Materials P 5000 Cluster is a semiconductor etch tool.[1]

The Applied Materials Precision 5000 Etcher is a cluster tool with four independently controlled etch chamber modules around a central loadlock.[2]

How it works

The Applied Materials Precision 5000 Etcher uses independently controlled chambers, and chambers A, B, and C are magnetically enhanced reactive ion etch systems with optical endpoint detection.[2]

The chamber configuration and system software support control over a wide range of process parameters.[2]

Where it fits in the process flow

The Applied Materials P 5000 Cluster supports metal etch, dielectric etch, and polysilicon etch use cases in separate chambers.[1][2]

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Chamber A is not usable and needs a new chamber.
  • Chamber C is not functioning, has gas flow issues, and requires new helium seals.

What do the numbers mean?

Power & electrical1

Power supplies[1]
Accurate?

Vacuum & pumping2

Pump stand[1]
Accurate?
Pumps[1]
Accurate?

Wafer handling1

Wafer size
4-inch/100mm wafer kit[1]
Accurate?

Gas & chemistry1

Chamber C
Polysilicon etch, not functioning, gas flow issues, new helium seals required[1]
Accurate?

Optics & imaging1

Endpoint Detection
Optical endpoint detection[2]
Accurate?

Configuration & options11

Chamber A
Metal etch, not usable (needs new chamber)[1]
Accurate?
Chamber B
Dielectric etch, fully functional[1]
Accurate?
Chamber D
Not used, status unknown[1]
Accurate?
With:[1]
Accurate?
Power distribution[1]
Accurate?
Chillers[1]
Accurate?
Chamber Type
Cluster tool with four chambers[2]
Accurate?
Etch Type (Chambers A, B, C)
Magnetically-Enhanced Reactive Ion Etch (MERIE)[2]
Accurate?
Chamber A Function
Metal etch[1]
Accurate?
Chamber B Function
Dielectric etch[1]
Accurate?
Chamber C Function
Polysilicon etch[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Chamber CPolysilicon etch, not functioning, gas flow issues, new helium seals required[1]
  • ConfigurationPump stand[1]
  • ConfigurationPumps[1]
  • ConfigurationPower supplies[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the P 5000 Cluster are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 5000 Cluster are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the P 5000 Cluster are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the P 5000 Cluster are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the P 5000 Cluster is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the P 5000 Cluster are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]nnci.net — nnci.netnnci.net
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Last updated Oct 8, 2026.

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