ASML
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The ASML Twinscan XT 1700 i is an immersion scanner operating at 193nm wavelength. The ASML Twinscan XT 1700 i is used for volume chip production at the 45nm node. The ASML Twinscan XT 1700 i has a throughput of 122 wafers per hour.[1]

The ASML Twinscan XT 1700 i operates at 193 nanometer wavelength and is designed for volume chip production at 45 nanometer mode. The system achieves a throughput of 122 wafers per hour. The XT 1700 i was introduced in 2006.[1]
The Twinscan architecture uses two independently movable wafer stages. While one stage is being exposed, the other stage performs wafer alignment, leveling, and pre-exposure measurements, allowing the system to achieve higher productivity.
Both front-end-of-line and back-end-of-line critical layers can be exposed on the system, depending on the device design.
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The following facts about the Twinscan XT 1700 i Immersion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Twinscan XT 1700 i Immersion are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Twinscan XT 1700 i Immersion are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Twinscan XT 1700 i Immersion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Twinscan XT 1700 i Immersion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Twinscan XT 1700 i Immersion is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.
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