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The Topaz X II uses a single beam gantry system. Two head configurations are available: a Super Fine (SF) head with eight placement heads, and a Flying Nozzle Change (FNC) head combination carrying four standard heads and four heads with nozzle exchange on-the-fly. Components are picked from tape, tray, stick, or waffle-pack feeders and placed onto PCBs transported by a conveyor.[2][4]
Alignment is performed by a line array camera for on-the-fly vision using the VICS processing system, and an area CCD camera for larger components. Fiducial alignment uses a moving CCD camera. The machine operates under Windows NT.[2][4]
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Topaz-XII with FNC head (PA 1314/01) | — | — | Equipped with fine-pitch nozzle change head (FNC) - one single beam with 4 standard heads and 4 heads with nozzle exchange on-the-fly | scribd.com[3] |
| Topaz-XII with SF head (PA 1314/02) | — | — | Equipped with super fine head (SF) - one single beam with 8 super fine heads | scribd.com[3] |
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The optimal placement speed is 20,000 CPH (components per hour). The IPC 9850 standard output is 15,400 CPH.[2]
Placement accuracy is ±50 microns at CpK 1 for chips and SOIC, ±40 microns for QFPs with 0.5 mm pitch, and ±35 microns for QFPs with 0.4 mm pitch. Angular accuracy for fine-pitch QFPs is ±0.09°.[2][4]
The maximum board size is 460 x 440 mm. A large-board option supports 650 x 850 mm. Minimum board size is 50 x 50 mm.[2]
Two head options exist: one single beam with 8 super fine (SF) heads, or one single beam carrying 4 standard heads and 4 heads with nozzle exchange on-the-fly (FNC).[2]
The following facts about the Topaz X II Placement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Topaz X II Placement are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Topaz X II Placement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Topaz X II Placement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Topaz X II Placement is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Topaz X II Placement are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Sep 24, 2026.
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