Besi
2100 FC Plus
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedWhere it fits in the process flow
General reference — not yet source-verifiedIn the packaging process flow, flip chip bonding follows wafer dicing and inspection and precedes reflow soldering, underfill dispensing, and final molding or encapsulation.
What do the numbers mean?
Wafer handling1
Dimensions & facilities1
Configuration & options3
Observed configurations
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
Unit as listed[1]
- Die bonding
- Track width: 125mm
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of substrates can this class of machine handle?General reference — not yet source-verified
Flip chip bonders are typically designed to handle a variety of substrates including laminate substrates (e.g., BT resin), ceramic substrates, lead frames, and flexible circuits, depending on the tool configuration and chuck design.
How does the machine align the die to the substrate?General reference — not yet source-verified
Most flip chip bonders use vision-based alignment systems that capture images of both the die bumps and the substrate pads. The system computes offset corrections and adjusts the placement position in real time, often achieving accuracy in the micrometer range.
What are common flux options used in flip chip bonding?General reference — not yet source-verified
Common flux types include no-clean fluxes, water-soluble fluxes, and flux pastes. The choice depends on the package reliability requirements and the subsequent cleaning or underfill processes.
What is the typical throughput of such a system?General reference — not yet source-verified
Throughput depends on die size, placement accuracy requirements, and process steps such as fluxing or reflow. High-speed machines can process a large number of units per hour, but actual rates vary widely by application and bonder architecture.
Can this machine handle different bump pitches and die sizes?General reference — not yet source-verified
Flip chip bonders are generally configurable to accommodate a range of bump pitches and die sizes, provided the tool's placement head and vision system are properly set up. Many systems support quick changeover kits to adapt to different product types.
Not publicly documented
The following facts about the 2100 FC Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2100 FC Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2100 FC Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 FC Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 FC Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]tarasemi.com — tarasemi.comtarasemi.com
- [3]micro-power.com.hk — micro-power.com.hkmicro-power.com.hk
Last updated Oct 9, 2026.
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