Buehler
390 IS 1160
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Buehler 390 IS 1160 is a low-speed saw used for dicing and grinding. The tool is categorized as a Dicing & Grinding system.[1][2]
What it is
General reference — not yet source-verifiedA dicing and grinding machine is used to separate material and prepare surfaces in a controlled mechanical process. A saw in this class typically supports wafer or specimen singulation and related sample-preparation work.
How it works
General reference — not yet source-verifiedA dicing saw uses a rotating cutting element to divide a workpiece along a controlled path. A grinding tool removes material by abrasive action to shape, thin, or flatten a surface.
Machines in this class are generally built to control motion, feed, and cut depth so the workpiece is processed with repeatable geometry. The same class is often used where a precise mechanical separation or surface-preparation step is needed before later handling or analysis.
Where it fits in the process flow
General reference — not yet source-verifiedA dicing and grinding machine sits in the back-end portion of a workflow where discrete pieces must be separated or prepared after earlier fabrication steps. The machine is used after the workpiece has reached a form that can be mechanically cut or ground.
The output from this class of equipment commonly moves to later inspection, assembly, or packaging steps. The machine can also serve sample-preparation flows where flatness, thickness control, or controlled sectioning is required.
Applications
General reference — not yet source-verifiedEquipment in this class is used for wafer singulation, specimen sectioning, and surface preparation. The class also supports controlled removal of material for tasks that require a flat or separated workpiece.
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 390 IS 1160 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 390 IS 1160 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 390 IS 1160 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 390 IS 1160 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 390 IS 1160 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 390 IS 1160 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]390 IS 1160 — Buehler | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Buehler 390 IS 1160 family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 9, 2026.
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