Denton Vacuum
The Denton Vacuum Discovery Cathode is a deposition system configured as a sputtering tool. The Denton Vacuum Discovery Cathode is a 12.0-inch sputtering system with planetary load lock and robot loading assemblies. The Denton Vacuum Discovery Cathode includes four 12-inch cathodes.[1][2]

Plate 01Denton Vacuum System: Changing a Cathode in a Discovery Sputtering System
The Denton Vacuum Discovery Cathode is a deposition system configured as a sputtering tool designed for semiconductor and thin-film manufacturing. The system is a 12.0-inch sputtering system that incorporates a planetary load lock and robot loading assemblies.[2][1]
The Discovery Cathode operates as a physical vapor deposition (PVD) tool using magnetron sputtering as its primary deposition method. The system includes a stainless steel chamber approximately 4 feet by 6 feet by 12 inches that houses the deposition process.[2][1]
The tool is equipped with four 12-inch cathodes that serve as target material holders for sputtering. Four Advance Energy Pinnacle plus DC power supplies provide the electrical energy needed to create a plasma for the sputtering process.[2][1]
Vacuum in the system is maintained by a CTI Cryogenics high vacuum pump with blanket heater, a Torr400 cryopump with Oxford E500 dual temperature monitor, and a KYKY F400 turbo molecular pump with FV-LII pump controller. The vacuum is further managed by a Vat gate valve and a Vat adaptive pressure controller, along with assorted pressure monitors and isolation valves. A CTI-Cryogenics 9600 compressor supports the cryogenic pumping system.[2][1]
The Discovery Cathode is used for sputter deposition of thin films of metals, dielectrics, and other materials in research, development, and small-scale production environments. The system includes a Veeco 5 cm gridded ion source with gas controls that can be used for ion beam milling or ion-assisted deposition.[2][1]
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The cathode can accommodate a wide range of solid target materials, including metals, alloys, ceramics, and certain cermets. The choice of target depends on the desired film composition and the driving power (DC for conductors, RF for insulators).
The magnetic field shape and strength determine the plasma confinement and target erosion profile. Static magnet arrays provide a simple, uniform field, while rotating or moving magnets can improve target utilization and film uniformity over extended use.
A direct current (DC) power supply is common for conductive targets, while radio frequency (RF) power is needed for sputtering insulating materials. Pulsed DC supplies are sometimes used to mitigate arcing in reactive sputtering processes.
Routine maintenance includes periodic replacement of the target when it erodes, cleaning of the cathode shield and support structures to remove re-deposited material, and inspection of magnets and electrical connections for wear or contamination.
Yes, such cathodes are often designed as modular components that can be flange-mounted or fitted into standard vacuum ports, provided the chamber geometry and pumping capacity are compatible with the sputtering pressure range.
The following facts about the Discovery Cathode are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Discovery Cathode are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Discovery Cathode are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Discovery Cathode are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Discovery Cathode are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Discovery Cathode is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 10, 2026.
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