Disco
DFL 7361
The Disco DFL 7361 is a laser saw for stealth dicing of wafers up to 300 mm. The Disco DFL 7361 uses a Type FX Laser Head and BSS-6 Optics System. The Disco DFL 7361 includes an integrated wafer cleaning system with atomizing nozzle.[1]
Wafer size
Integrated Wafer Cleaning System with Atomizing Nozzle
Power
Uninterruptible Power Supply[1]
Performance
0.003 mm within 310 mm[5]
Optics
Type FX Laser Head[1]
What it is
The DFL 7361 can accommodate wafers with diameters from 2 inches to 12 inches. The system includes a Type FX Laser Head, a BSS-6 Optics System, and a chuck table that moves in the X and Y directions. The machine features a graphical user interface with touch screen, a high-resolution image processing system with auto focus, and a fully automatic frame handling system.[1][2][6]
How it works
General reference — not yet source-verifiedLaser saws such as the DFL 7361 operate by focusing a laser beam onto the workpiece to remove material or create internal modifications. The chuck table holds the wafer and moves it in the X and Y axes under the laser. A high-resolution camera and image processing system provide pattern recognition and auto focus for precise alignment. The entire process is automated through software control.
Where it fits in the process flow
The DFL 7361 incorporates a fully automatic frame handling system for loading and unloading cassettes. The system also includes an integrated wafer cleaning system with atomizing nozzle and an independent spin coating system, indicating that cleaning and coating steps can be performed within the machine.[1][2][6]
What do the numbers mean?
Power & electrical3
- Uninterruptible Power Supply[1]
Wafer handling14
- Chuck Table moving in X- and Y- direction[1]
- 12" Porous Chuck Table & Spinner Table[1]
- 8" Porous Chuck Table & Spinner Table[1]
- Cassette Loading / Unloading[1]
- Chuck table
- Chuck Table moving in X- and Y-direction; 12" and 8" Porous Chuck Table & Spinner Table[1]
Optics & imaging11
Performance3
Control & software4
Dimensions & facilities3
Configuration & options24
- Fully Automatic Frame Handling System[1]
- Independent Hogomax spin coating system[1]
- Duct Unit (Internal Type)[1]
- Overseas Transformer Unit[1]
- Operation & Troubleshooting Manual (English)[1]
- Installation and 3-days Operation Training[1]
- Options:[1]
- Intemal lighting[1]
- Documentation
- Operation & Troubleshooting Manual (English); Installation and 3-days Operation Training[1]
- Ablation processing support
- Supports ablation processing; corresponding to 300mm workpiece[5]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| SECS/GEM Software | — | — | Listed as an option. | Equipment inventory listing[1] |
| Intemal lighting | — | — | Listed as an option. | Equipment inventory listing[1] |
| Virus-free PC | — | — | Listed as an option. | Equipment inventory listing[1] |
| STM DFL7161 2021 SW unified | — | — | Listed as an option. | Equipment inventory listing[1] |
| Barcode reading function for auto recipe loading | — | — | Listed as an option. | Equipment inventory listing[1] |
| Compatibility with Hogomax 5L tanks | — | — | Listed as an option. | Equipment inventory listing[1] |
| Change of Laser Focus Position for Maintenance | — | — | Listed as an option. | Equipment inventory listing[1] |
| Additional Kerf check sequence | — | — | Listed as an option. | Equipment inventory listing[1] |
| Password Modification up to Level 4 | — | — | Listed as an option. | Equipment inventory listing[1] |
| Disco CO2 Injector + Integration specs | — | — | Listed as an option. | Equipment inventory listing[1] |
| CO2 injector (stand-alone) added | — | — | Listed as an option. | Equipment inventory listing[1] |
| Addition of drain valve for CO 2 injector specific resistance value stabilization | — | — | Listed as an option. | Equipment inventory listing[1] |
| CO2 water target resistivity value Settable in device data | — | — | Listed as an option. | Equipment inventory listing[1] |
| CO2 bubbler support (RS232C) | — | — | Listed as an option. | Equipment inventory listing[1] |
| New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM) | — | — | Listed as an option. | Equipment inventory listing[1] |
| DFL7360 | — | — | Different dimensions (1,715 x 3,265 x 1,998 mm) and weight (approx 2,770 kg); X-axis feed speed 1.0 - 1,000 mm/s | web.archive.org[5] |
| DFL7360FH | — | — | Different dimensions (1,100 x 2,100 x 1,990 mm) and weight (approx 2,090 kg) | web.archive.org[5] |
| DFL7341 | — | — | Corresponding to 200mm workpiece; maximum workpiece size ø200 | web.archive.org[5] |
| DFL7340 | — | — | Corresponding to 200mm workpiece; maximum workpiece size ø200 | web.archive.org[5] |
| DFL7161 | — | — | Mentioned as DFL7161 model with related specifications and in options text as target of some upgrades | Equipment inventory listing[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does the grinding process work in this class of equipment?General reference — not yet source-verified
The grinding process uses a rotating grinding wheel with abrasive particles that mechanically remove material from the wafer backside, often facilitated by a coolant to manage heat and remove debris. The system can control thickness removal precisely.
What are the main quality factors considered when using these machines?General reference — not yet source-verified
Key factors include die strength after grinding, edge chipping quality during dicing, alignment accuracy for die separation, and overall throughput. Consistency across the wafer and overlay accuracy are critical for yield.
What are the main operational requirements for such a system?General reference — not yet source-verified
Operational requirements generally include cleanroom compatibility, stable environmental conditions (temperature, humidity), proper alignment of input and output cassettes, and regular maintenance of grinding wheels and dicing blades to ensure consistent performance.
Not publicly documented
The following facts about the DFL 7361 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7361 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DFL 7361 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL 7361 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL 7361 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DFL 7361 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]web.archive.org — disco.co.jp (Jul 3, 2015)web.archive.org
- [6]Equipment inventory listing
Last updated Oct 2, 2026.
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