Disco
DGP 8761 HC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedGrinding and dicing machines of this class perform backend processing steps that reduce wafer thickness and separate individual dies from a semiconductor wafer. Such equipment typically combines precision grinding and dicing functions in a single integrated platform.
How it works
General reference — not yet source-verifiedWafer grinding and dicing machines operate by holding a wafer on a chuck and using a rotating grinding wheel to remove material from the backside of the wafer. The process may involve multiple grinding steps with progressively finer abrasives to achieve the desired thickness and surface finish.
The dicing function employs a diamond-impregnated blade that cuts along scribe lines to separate the wafer into individual chips. The machine coordinates grinding and dicing operations through a precision motion control system that positions the wafer relative to the tool.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor fabrication, grinding and dicing equipment is used after front-end wafer processing is complete and before final packaging. The machine thins the wafer to a specified thickness and then singulates the dies, making the parts ready for subsequent assembly and packaging steps.
Upstream steps include wafer sorting and test; downstream steps include die attach, wire bonding, and encapsulation. The integration of grinding and dicing in one tool reduces handling and improves process efficiency.
What do the numbers mean?
No specifications recorded yet
Be the first to add cited specifications for this tool.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DGP 8761 HC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the DGP 8761 HC are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8761 HC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8761 HC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8761 HC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8761 HC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]DGP 8761 HC — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
Compare with similar tools
View all →
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
