Esec
Datacon 8800 CHAMEO ultra plus AC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Datacon 8800 CHAMEO ultra plus AC is a Die Attach Hybrid Bonding system listed in Besi's product portfolio.[1]
What it is
The Esec Datacon 8800 CHAMEO ultra plus AC is a die bonding system for packaging and bonding operations.[1]
The Esec Datacon 8800 CHAMEO ultra plus AC belongs to a hybrid bonding product family that also includes flip chip and thermo compression bonding platforms.[1]
How it works
General reference — not yet source-verifiedA die bonder picks semiconductor dies from a source format and places them onto a target substrate with controlled alignment, adhesive or attachment material handling, and bonding force or cure steps as required by the process.
Die bonding equipment in this class is generally built around motion control, vision alignment, dispensing or attachment subsystems, and process monitoring to support accurate placement and repeatable attachment.
Where it fits in the process flow
The Esec Datacon 8800 CHAMEO ultra plus AC is suited to packaging lines that require die attach as part of semiconductor assembly.[1]
Applications
The Esec Datacon 8800 CHAMEO ultra plus AC is part of a product family associated with die attach, hybrid bonding, flip chip, and thermo compression bonding.[1]
What do the numbers mean?
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of equipment is the Esec Datacon 8800 CHAMEO ultra plus AC?
The Esec Datacon 8800 CHAMEO ultra plus AC is a die bonding system for packaging and bonding operations.[1]
Not publicly documented
The following facts about the Datacon 8800 CHAMEO ultra plus AC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Datacon 8800 CHAMEO ultra plus AC are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Datacon 8800 CHAMEO ultra plus AC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Datacon 8800 CHAMEO ultra plus AC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Datacon 8800 CHAMEO ultra plus AC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Datacon 8800 CHAMEO ultra plus AC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 3, 2026.
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