Esec
Esec 2100 sD advanced i
The Esec 2100 sD advanced i is a die bonder. The Esec 2100 sD advanced i is a 3rd generation 300 mm high speed platform. The Esec 2100 sD advanced i supports epoxy die attach applications.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Esec 2100 sD advanced i is a die bonder for epoxy die attach in packaging and bonding operations. The Esec 2100 sD advanced i belongs to the Esec 2100 high-speed platform family.[1]
How it works
The Esec 2100 sD advanced i uses a Phi-Y concept that combines rotational and linear movements for pick-and-place motion. The Esec 2100 sD advanced i supports real-time process monitoring through four live images of the process zone, real-time wafer, strip, and magazine viewing, and context-sensitive online help.[1]
The Esec 2100 sD advanced i supports epoxy, soldering, thermo-compression, and eutectic processes. The Esec 2100 sD advanced i also includes options for dispensing, strip handling, ionizer functions, wafer mapping, host communication, and bond quality checking.[1]
Where it fits in the process flow
The Esec 2100 sD advanced i is specified for leadframe sizes from 90 mm to 300 mm in length and from 23 mm to 100 mm in width. The Esec 2100 sD advanced i is specified for wafer sizes from 4 inches to 12 inches on 8 inch or 12 inch wafer frames.[1]
Applications
The Esec 2100 sD advanced i supports die sizes from 0.25 mm with a Small Die Kit to 20 mm. The Esec 2100 sD advanced i is specified with a bonding accuracy of 20 µm at 3σ and an option for 15 µm at 3σ.[1]
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options3
What replaced it?
Related models
- siblingEsec Esec 2100 hS— The source lists Esec 2100 sD advanced i alongside Esec 2100 hS in the die bonding product family.source[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding methods does the Esec 2100 sD advanced i support?
The Esec 2100 sD advanced i supports epoxy, soldering, thermo-compression, and eutectic processes.[1]
What wafer sizes are specified for the Esec 2100 sD advanced i?
The Esec 2100 sD advanced i is specified for wafer sizes from 4 inches to 12 inches on 8 inch or 12 inch wafer frames.[1]
What machine dimensions are given for the Esec 2100 sD advanced i?
The Esec 2100 sD advanced i is specified at 1785 x 1448 x 1400 mm in width, depth, and height.[1]
Not publicly documented
The following facts about the Esec 2100 sD advanced i are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Esec 2100 sD advanced i are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Esec 2100 sD advanced i are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Esec 2100 sD advanced i are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Esec 2100 sD advanced i are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Esec 2100 sD advanced i is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 4, 2026.
Compare with similar tools
View all →The Esec 2009 fS E is an epoxy die bonder for 300 mm high-speed die attach applications. The Esec 2009 fS E supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.
The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is a 300 mm high-speed platform with support for wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.
The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is described as a 3rd generation 300 mm high speed platform with 20 µm bonding accuracy and an optional 15 µm placement accuracy in High Accuracy Mode.
The MRSI 505 Die Attach is a packaging and bonding machine for semiconductor assembly, used for die attach and multichip module work.
The Datacon 2200 evo is a die bonder for epoxy die attach applications.
The Esec Datacon 2200 evo advanced is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo advanced is described as a flexible 300 mm high-speed platform with wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.