Hesse & Knipps
BJ 820 Wire Bonder Transport
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Hesse & Knipps BJ 820 is a fully automatic wedge bonder designed for high-speed fine-pitch wire bonding. The BJ 820 is also offered as a transport system configuration that integrates an indexer or transport mechanism for automated substrate handling. The machine is built on the Bondjet platform and is intended for volume production in semiconductor packaging.[1][2][3]
How it works
The machine achieves a positioning repeatability of 1 µm at 3 sigma with an interpolated encoder resolution of 20 nm. Bond speed can reach up to 7 wires per second depending on wire diameter, loop length, and application conditions. The working area is 305 mm by 410 mm, which can be partitioned into multiple smaller stations to eliminate indexing time and maximize throughput.[2][3]
Where it fits in the process flow
The BJ 820 is used in the back-end semiconductor packaging process, specifically for wire bonding after die attach and before encapsulation or molding. The transport system configuration integrates directly into automated production lines via SMEMA interfaces, Profibus, and an integrated PLC controller.[2][3]
The machine supports both manual and fully automated operation. With the transport variant, substrates are moved through the bonder by an indexer, magazine lift, or conveyor system, allowing the BJ 820 to be embedded in a larger assembly line. The software provides portability of bond programs and supports centralized data management via the PBS200 server for up to 20 bonders.[3][2]
What do the numbers mean?
Control & software1
- Integrated controls
- Integrated PLC controller; standard SMEMA input and output ports; Profibus support[2]
Dimensions & facilities1
Configuration & options15
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding modes does the BJ 820 support?
The BJ 820 supports wedge bonding with aluminium or gold wire or ribbon.[2][3]
What applications is the BJ 820 intended for?
The BJ 820 is intended for RF and microwave devices, chip-on-board assemblies, multichip modules, hybrids, fiber optics, and automotive electronics.[2][3]
Not publicly documented
The following facts about the BJ 820 Wire Bonder Transport are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BJ 820 Wire Bonder Transport are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BJ 820 Wire Bonder Transport are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BJ 820 Wire Bonder Transport are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BJ 820 Wire Bonder Transport are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BJ 820 Wire Bonder Transport is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]keers-technologies.com — keers-technologies.comkeers-technologies.com
- [3]https://accelonix.nl/wp-content/uploads/bros-mk-bondjet-bj820-en-20160901.pdf — accelonix.nlaccelonix.nl
Last updated Oct 8, 2026.
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