Hitachi
DB 730 AC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Hitachi DB 730 AC is a die bonder.[1]
What it is
How it works
General reference — not yet source-verifiedDie bonders typically operate by picking a die from a wafer or tape-and-reel carrier and placing it onto a substrate with high positional accuracy.
The attachment is achieved through a bonding medium such as epoxy, solder preform, or adhesive film, and may be followed by a curing or reflow step to solidify the joint.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding is performed after wafer dicing and before wire bonding or encapsulation in the semiconductor packaging process flow.
The upstream step is wafer dicing, which singulates dies from the wafer; the downstream steps typically include wire bonding or flip-chip interconnection and finally encapsulation or molding.
Applications
General reference — not yet source-verifiedDie bonders are used in the assembly of a wide range of semiconductor packages, including quad flat packages, ball grid arrays, and multichip modules.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the DB 730 AC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the DB 730 AC are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DB 730 AC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DB 730 AC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DB 730 AC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DB 730 AC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]DB 730 AC — Hitachi | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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