KLA
eV 300
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
The eV 300 provides automatic defect classification (ADC) to sort defects by type in real time. The tool supports tilt and rotation of the wafer for multi-angle imaging, voltage contrast review for electrical defect detection, and high aspect ratio interconnect (HARI) imaging for deep structures. Landing energy can be set up to 19 keV, enabling unambiguous material identification. The system integrates with KLA-Tencor's Klarity Defect data management platform for further analysis and excursion monitoring.[2]
Applications
The eV 300 is suited for both in-line monitoring and engineering analysis at 0.13 micron and smaller technology nodes. Specific capabilities include voltage contrast review for electrical defect detection, high aspect ratio interconnect (HARI) imaging for deep vias and trenches, and elemental analysis via EDX when equipped.[2][3]
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What landing energy does the eV 300 support?
The eV 300 supports landing energy up to 19 keV.[2]
What wafer sizes can the eV 300 handle?
The eV 300 can be configured to handle 150 mm, 200 mm, or 300 mm wafers.[2]
What design rules is the eV 300 intended for?
The eV 300 is intended for 0.13 micron and smaller design rules.[2]
How does the eV 300 improve productivity over manual SEM review?
The eV 300 delivers a four-fold increase in productivity compared to manual SEM review systems.[2]
Not publicly documented
The following facts about the eV 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the eV 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the eV 300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the eV 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the eV 300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the eV 300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]KLA-Tencor's eV 300 | Engagez — engagez.netengagez.net
- [3]KLA-Tencor EV 300 Scanning Electron Microscope with Oxford EDX for sale — fabsurplus.comfabsurplus.com
- [4]KLA Tencor | Certified Used Equipment | Opti-Probe® 3291 (DUV) — kla-tencor.com (Jan 24, 2010)web.archive.org
- [5]KLA-Tencor | Products | eS25 — tencor.com (Dec 21, 2003)web.archive.org
Last updated Sep 24, 2026.
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