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Koh Young

KY 8030 3D

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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The KY8030 series is a line of True 3D solder paste inspection (SPI) systems from Koh Young. The KY8030 series is Koh Young’s most widely deployed 3D solder paste inspection platform, available in three configurations: the KY8030-2, KY8030-3, and USX. The platform uses Koh Young's patented 3D dual-inspection moiré projection technology.[1]

KY 8030 3D — Inventory photo
Fig. 01KY 8030 3DInventory photo[2]

How it works

A solder paste inspection system measures deposited solder paste on a printed circuit board before component placement. The KY8030 platform measures paste volume, area, height, offset, bridging, shape deformity, and coplanarity rather than judging a two-dimensional image.[1]

Where it fits in the process flow

Solder paste inspection sits after solder paste printing and before component placement and reflow. The inspection step is used to catch deposit defects while the board is still early in the assembly flow.[1]

What do the numbers mean?

Optics & imaging1

Resolutions (KY8030-2)
10, 15, 20 or 25 microns[1]
Accurate?

Dimensions & facilities2

Max Paste Height (KY8030-2)
450 microns[1]
Accurate?
Max Inspection Height (KY8030-3)
400 microns[1]
Accurate?

Configuration & options5

Inspection Speed (KY8030-2)
11.1 to 59.5 cm²/sec[1]
Accurate?
Inspection Speed (KY8030-3)
81.85 cm²/sec at 8 megapixel and 20 microns[1]
Accurate?
Max Board Length (USX)
1,300 millimetres[1]
Accurate?
Base Model
KY 8030[2]
Accurate?
Vintage
2011[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
KY8030-2——The most widely installed configuration; inspects from 11.1 to 59.5 cm²/sec to a paste height of 450 microns, with resolutions of 10, 15, 20 or 25 microns.kohyoungamerica.com[1]
KY8030-3——Roughly twice the throughput of the KY8030-2, reaching 81.85 cm²/sec at 8 megapixel and 20 microns, to a 400 micron inspection height; also inspects conductive glue and sinter paste.kohyoungamerica.com[1]
KY8030 USX——Extended-length configuration of the KY8030-3, for assemblies up to 1,300 millimetres in a single pass.kohyoungamerica.com[1]
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Not publicly documented

Field notes

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Not publicly documented

The following facts about the KY 8030 3D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the KY 8030 3D are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the KY 8030 3D are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the KY 8030 3D are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the KY 8030 3D is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the KY 8030 3D are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]kohyoungamerica.com — kohyoungamerica.comkohyoungamerica.com
  2. [2]Inventory photo
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Last updated Oct 9, 2026.

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