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Kulicke & Soffa

4524

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Kulicke & Soffa 4524 is a ball bonder used for wire bonding in semiconductor packaging. The Kulicke & Soffa 4524 includes stereo zoom optics and a heated workholder.[1][2]

Kulicke & Soffa4524
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What it is

The Kulicke & Soffa 4524 is a ball bonder. The 4524 is a bonder used in semiconductor packaging.[3][2][1]

How it works

The Kulicke & Soffa 4524 includes a heated workholder. The 4524 includes stereo zoom optics for alignment.[2]

Where it fits in the process flow

General reference — not yet source-verified

The 4524 is used in the packaging stage of semiconductor manufacturing. The machine operates after die attach and before encapsulation. The wire bonds connect the die to the package leads.

What do the numbers mean?

Optics & imaging1

Optics
Stereo zoom optics[2]
Accurate?

Configuration & options6

Manual[3]
Accurate?
Machine type
Bonder[2]
Accurate?
Machine type
Ball bonder[1]
Accurate?
Workholder
Heated workholder[2]
Accurate?
Vintage
2009[3]
Accurate?
Bonder type
Ball bonder[1]
Accurate?
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Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

  • K&S 4524 Manual Ball BonderIn Productionsource[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of wire can the machine bond?General reference — not yet source-verified

Wire bonders of this class typically handle gold, copper, and sometimes aluminum wire. The specific wire material compatibility depends on the bond head design, capillary geometry, and the ultrasonic frequency used.

What is the typical throughput of such systems?General reference — not yet source-verified

Throughput varies by machine class and application, but these systems are designed for high-speed operation in volume manufacturing. Actual bond rates depend on factors such as bond length, size, and complexity of the bond program.

What kind of bond quality inspection is available?General reference — not yet source-verified

Many wire bonders incorporate vision systems for bond placement verification and offer integrated pull or shear testing capabilities for process control and quality assurance.

What substrate types are supported?General reference — not yet source-verified

Wire bonders can accommodate various substrate formats, including lead frames, BGA substrates, ceramic packages, and other package types, with appropriate tooling and handling options.

Is the machine capable of multi-level bonding?General reference — not yet source-verified

Yes, when configured with suitable software and bond head motion capabilities, these machines can bond to multiple levels, such as different die heights within a stacked-die package.

Not publicly documented

The following facts about the 4524 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4524 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 4524 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 4524 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 4524 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 4524 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
  2. [2]wotol.com — wotol.comwotol.com
  3. [3]inventory listing
  4. [4]Equipment inventory listing
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Last updated Sep 29, 2026.

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