Kulicke & Soffa
Maxum Plus
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The K&S Maxum Plus is a wire bonder. The K&S Maxum Plus is manufactured by K&S. The K&S Maxum Plus is semiconductor manufacturing equipment.[1][2]
What it is
General reference — not yet source-verifiedThe Kulicke & Soffa Maxum Plus is a wire bonder used in semiconductor packaging. Wire bonders form the electrical connections between the integrated circuit die and the package substrate or leadframe. The Maxum Plus is part of Kulicke & Soffa's Maxum series of automatic ball bonders.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor assembly, wire bonding follows die attach and precedes encapsulation or molding. The package is placed in the bonder after the die has been mounted on the substrate. After wire bonding, the package moves to encapsulation to protect the connections. Wire bonding is a critical step in most traditional IC packaging flows.
What do the numbers mean?
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Maxum Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Maxum Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Maxum Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Maxum Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Maxum Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Maxum Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Equipment inventory listing
Last updated Sep 22, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
