Lam Research
9400 SE Poly
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam 9400 SE Poly Etcher is an etching system manufactured by Lam Research. The Lam 9400 SE Poly Etcher is designated as a poly-silicon etcher.[1]
What it is
The Lam 9400 SE is a poly etcher used in semiconductor manufacturing.[1]
How it works
General reference — not yet source-verifiedThe system typically includes a wafer handling robot, multiple process chambers for increased throughput, and endpoint detection to stop etching precisely when the underlying layer is reached. Temperature and pressure controls maintain process stability.
Where it fits in the process flow
General reference — not yet source-verifiedPoly etchers are used in the front-end-of-line portion of semiconductor fabrication, following polysilicon deposition and photolithographic patterning. The polysilicon layer is often deposited via low-pressure chemical vapor deposition over a thin gate oxide. After etching, the remaining photoresist is stripped, and subsequent processing includes oxidation, doping, and dielectric deposition.
Applications
General reference — not yet source-verifiedIn advanced nodes, poly etching may also be applied to polycide or silicide stacks where a metal silicide layer is formed on top of polysilicon. The process chemistry is adapted to achieve selectivity over the underlying gate oxide.
What do the numbers mean?
Power & electrical1
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Lam 9400 SE 308v | — | — | — | Equipment inventory listing[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage308v[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 9400 SE Poly are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 9400 SE Poly are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9400 SE Poly are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 9400 SE Poly are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 9400 SE Poly are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 9400 SE Poly is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]inventory listing
Last updated Sep 25, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
