Lam Research

Exelan Flex

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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

The Exelan Flex is a member of the Lam Research 2300 series and is configured for 300 mm (12‑inch) wafer processing. The chamber is used for oxide etching (dielectric etch).^[3]^[4]^[2]^[5]

How it works

The Exelan Flex chamber is supplied with an RF unit and a gas box that deliver the power and process gases needed for plasma generation. The chamber includes components such as chamber liners, a heater plate, and an electrostatic chuck (e‑chuck) that are cleaned during preventive maintenance using specified scrubbing and wiping procedures.^[4]^[5]

Why won't it start?

Documented failure modes, common issues, and field considerations.

Tool status requires audit to verify configuration.

What do the numbers mean?

Wafer handling1

Wafer size: 12 inch^[2]

Configuration & options12

OEM: Lam Research^[2]
Model: Exelan Flex^[2]
Asset description: Lam Exelan Flex Chamber^[2]; 2300 Exelan Flex 300mm configuration^[3]
Process type: Oxide Etch^[3]
Vintage: 2005^[3]
Tool description: 2300 Exelan Flex FX - Chamber Only^[4]
Current configuration: 300mm^[4]
Status: Available^[4]
Date of manufacture: 2018-01-01^[1]
Configured for: To be determined^[1]
Process module: 2300 FLEX GX OPTIONS^[1]

Vintage & configurations

2018-01-01Manufacture date^[1]
Date of manufacture is stated as 2018-01-01.

Documented models & variants

Designation	Generation	Vintage	Changes	Source
2300 Exelan Flex FX	—	—	Described as chamber only and associated with dielectric etch.	macquarie.com^[4]
2300e4 Exelan Flex GX	—	2018	Described as a 2300e4 platform with Exelan Flex GX configuration.	macquarie.com^[1]

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of etching does the Exelan Flex perform?

The Exelan Flex is a dielectric etch chamber used for oxide etching.^[5]^[4]

Which Lam Research series does the Exelan Flex belong to?

The Exelan Flex is part of the Lam Research 2300 series.^[5]^[4]^[1]

Not publicly documented

The following facts about the Exelan Flex are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

The control-system platform and OS era of the Exelan Flex are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Exelan Flex is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Exelan Flex are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Exelan Flex are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No description of the Exelan Flex is on record.
Answerable by: an engineer who operated it or an OEM application specialist

Sources & citations

Sources (5)Every fact above is drawn from these public sources

[1]macquarie.com — macquarie.commacquarie.com
[2]Equipment inventory listing
[3]solutions-on-silicon.com — solutions-on-silicon.comsolutions-on-silicon.com
[4]macquarie.com — macquarie.commacquarie.com
[5]https://www.foamtecintlwcc.com/wp-content/uploads/2023/09/lam-2300-flex-oxide-etch.pdf — foamtecintlwcc.comfoamtecintlwcc.com