Waferpedia

Lapmaster

12 Lapper

CMP
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Lapmaster 12 is a lapping and polishing machine manufactured by Lapmaster. The Lapmaster 12 has a lapping speed range of 0 to 60 rpm. The Lapmaster 12 is suitable for wafers of 4 inches or smaller.[1][2]

Lapmaster12 Lapper
No photo available yet

Power

110 V[2]

Gas delivery

Yes[2]

What it is

The Lapmaster 12 is a lapping and polishing machine. The machine is suitable for 4-inch wafers or smaller. The Lapmaster 12 includes a timer, three rings, three weights, and a slurry system. The machine operates on 110 V, 60 Hz, single-phase power.[3][1][2]

How it works

General reference — not yet source-verified

Lapping machines use a rotating flat plate called the lapping plate. An abrasive slurry is applied to the plate. Workpieces are held in place by carriers and pressed against the plate by weights. The relative motion between the plate and the workpiece removes material through abrasion.

What do the numbers mean?

Power & electrical2

Input Voltage
110 V[2]
Accurate?
Frequency
60 Hz[2]
Accurate?

Wafer handling1

Wafer Size Compatibility
4 inches or smaller[2]
Accurate?

Gas & chemistry1

Includes Slurry System
Yes[2]
Accurate?

Dimensions & facilities1

Number of Weights
3[2]
Accurate?

Configuration & options5

Outside plate diameter
12 inches[2]
Accurate?
Lapping Speed Range
0 to 60 rpm[1]
Accurate?
Phase
1[2]
Accurate?
Number of Rings
3[2]
Accurate?
Includes Timer
Yes[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Input Voltage110 V[2]
  • Frequency60 Hz[2]
  • Includes Slurry SystemYes[2]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What does the Lapmaster 12 do?

The Lapmaster 12 is a lapper or polisher.[3][2]

How does conventional lapping remove material?

Conventional lapping uses slurry with abrasive particles in a lapping fluid, and the abrasives remove material by rolling and scratching in the working zone.[1]

Not publicly documented

The following facts about the 12 Lapper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 12 Lapper are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 12 Lapper are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 12 Lapper are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 12 Lapper are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 12 Lapper is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]etd.ohiolink.edu — etd.ohiolink.eduetd.ohiolink.edu
  2. [2]jmind.com — jmind.comjmind.com
  3. [3]Equipment inventory listing
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Last updated Oct 8, 2026.

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