Waferpedia

Laurell

EDC-650-15

Spin coater / spin processor300mm650-seriesLaurell EDC-650-15 family
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EDC-650-15 — web.archive.org
Fig. 01EDC-650-15web.archive.org[1]

Wafer size

300mm

Power

95 to 240 VAC, 47/63 Hz, ~300 W[1]

Vacuum

12,000 RPM with vacuum hold-down[1]

What it is

The Laurell EDC-650-15 B is a compact spin processor belonging to Laurell's 650-series EDC product line. The system accommodates substrates up to 300 mm in diameter and 229 mm by 229 mm square substrates. Although the drive is capable of 12,000 RPM with vacuum hold-down, the manufacturer recommends operation at 3,000 RPM and use of non-vacuum chucks. The system features a microprocessor-based 650-series process controller that allows real-time operator interaction, downloadable firmware updates, and optional PC-based control via Spin 3000 software. The housing is typically made from a proprietary solid co-polymer blend resistant to solvents and strong acids and bases. The process chamber uses an internal bowl shape with a bottom gutter and a clear dome lid. Safety certifications include ETL, UL, CSA, CE, and RoHS compliance.[1][2][3][4][5]

How it works

The EDC-650-15 B uses a proprietary labyrinth seal that provides nitrogen purge to protect the motor and electronics from chemical contamination. The process chamber is electrically interlocked so that rotation and dispensing are disabled when the lid is open. An adjustable down-flow exhaust and drain monitors the chamber's atmospheric balance for repeatability. A bowl-wash and dry routine can be added to each process. The 650-series controller monitors exhaust pressure and optionally other parameters such as temperature and pH. The system's process safeguard prevents the same process from being run twice on the same substrate without opening the lid.[1][2][3][4][5]

What can it run?

Process applications and technology nodes documented for this tool.

  • Etch
  • Develop
  • Clean

What do the numbers mean?

Power & electrical2

Power
95 to 240 VAC, 47/63 Hz, ~300 W[1]
Accurate?
Power requirements
95 to 240 VAC, 47/63 Hz, ~300 W[1]
Accurate?

Vacuum & pumping8

Maximum speed capability
12,000 RPM with vacuum hold-down[1]
Accurate?
Recommended chuck type
non-vacuum chucks[1]
Accurate?
Required nitrogen/CDA purge pressure
60–70 PSIG (4–5 bar)[1]
Accurate?
Suggested vacuum
25–28 inches Hg[1]
Accurate?
Maximum rotational speed
12,000 RPM (with vacuum hold-down)[1]
Accurate?
Recommended rotational speed
3,000 RPM (with non-vacuum chucks)[1]
Accurate?
Nitrogen / CDA purge pressure
60–70 PSIG (4–5 bar) for motor seal and chamber purge[1]
Accurate?
Vacuum requirement
25–28 inches Hg (~635–711 mm Hg) at 4.5 SCFM (0.127 m³/min)[1]
Accurate?

Wafer handling3

Wafer capacity
up to Ø 300 mm wafers[1]
Accurate?
Substrate capacity
9" × 9" (229 mm × 229 mm) substrates[1]
Accurate?
Substrate size maximum
Up to Ø 300 mm wafers and 9" × 9" (229 mm × 229 mm) substrates[1]
Accurate?

Gas & chemistry2

Supported processes
Etch, Develop, Clean, typically followed by solvent or aqueous rinse, then dry[1]
Accurate?
Housing material (standard)
Solid co-polymer blend (proprietary, solvent- and acid-resistant)[1]
Accurate?

Control & software2

Process controller
650-series process controller[1]
Accurate?
Process controller
650-series microprocessor-based controller; optional PC software (Spin 3000) for remote operation and simulation[1]
Accurate?

Configuration & options7

Model
EDC-650-15 B[1]
Accurate?
System type
Station mounted EDC-650-15 spin processor[1]
Accurate?
Recommended speed
3,000 RPM[1]
Accurate?
Nitrogen consumption (standard motor)
3 cubic feet per hour (0.085 m³/hour)[1]
Accurate?
Nitrogen consumption (high-performance motor)
20 cubic feet per hour (0.566 m³/hour)[1]
Accurate?
Housing material (optional)
Solid PTFE Hostaflon TFM-1600 / Teflon AF[1]
Accurate?
Safety certifications
CE and RoHS compliant; UL and CSA approved components; ETL certification mentioned[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
EDC-650-15 B650-series—Variant designation shown in the sources; no differences versus the base line are explicitly stated.web.archive.org[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Maximum speed capability12,000 RPM with vacuum hold-down[1]
  • Recommended chuck typenon-vacuum chucks[1]
  • Power95 to 240 VAC, 47/63 Hz, ~300 W[1]
  • Required nitrogen/CDA purge pressure60–70 PSIG (4–5 bar)[1]
  • Suggested vacuum25–28 inches Hg[1]
  • Supported processesEtch, Develop, Clean, typically followed by solvent or aqueous rinse, then dry[1]
  • Maximum rotational speed12,000 RPM (with vacuum hold-down)[1]
  • Recommended rotational speed3,000 RPM (with non-vacuum chucks)[1]
  • Power requirements95 to 240 VAC, 47/63 Hz, ~300 W[1]
  • Nitrogen / CDA purge pressure60–70 PSIG (4–5 bar) for motor seal and chamber purge[1]
  • Vacuum requirement25–28 inches Hg (~635–711 mm Hg) at 4.5 SCFM (0.127 m³/min)[1]
  • Housing material (standard)Solid co-polymer blend (proprietary, solvent- and acid-resistant)[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the maximum substrate size the EDC-650-15 can handle?

The EDC-650-15 accommodates up to 300 mm wafers and 9" x 9" (229 mm x 229 mm) substrates.[1][2][3][4][5]

What is the spin speed capability of the EDC-650-15?

The system is capable of 12,000 RPM with vacuum hold-down, but the manufacturer recommends operation at only 3,000 RPM and use of non-vacuum chucks.[1][2][3][4][5]

What processes does the EDC-650-15 support?

The supported processes include etch, develop, and clean, typically followed by a solvent or aqueous rinse and a dry step.[1][2][3][4][5]

What safety certifications does the EDC-650-15 have?

The system is ETL, UL, CSA, CE, and RoHS compliant.[1][2][3][4][5]

Not publicly documented

The following facts about the EDC-650-15 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EDC-650-15 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the EDC-650-15 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the EDC-650-15 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the EDC-650-15 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the EDC-650-15 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
  4. [4]Spin Coater - Laurell Model EDC-650-15 — laurell.comlaurell.com
  5. [5]EDC-650-15 Spin Coater - Laurell Technologies — images.laurell.comimages.laurell.com
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Last updated Sep 24, 2026.

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