Shinkawa

COF 300 Flip Chip

Packaging & Bonding Shinkawa COF 300 Flip Chip family

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ShinkawaCOF 300 Flip Chip

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What it is

The Shinkawa COF 300 is a flip chip bonder. The COF 300 is used in semiconductor packaging and bonding. The machine handles wafers of 8-inch diameter. The COF 300 belongs to the assembly segment of semiconductor manufacturing equipment.^[1]^[2]^[3]^[4]

How it works

General reference — not yet source-verified

Flip chip bonding inverts the die so that its interconnect bumps face the substrate. The bonder aligns the bump pattern of the die to matching pads on the substrate. The machine then brings the die into contact and applies heat, pressure, or both to form the electrical and mechanical joint. Alignment accuracy and controlled bond force determine joint quality and yield in this process.

Applications

General reference — not yet source-verified

Flip chip bonding serves packaging formats that require dense, short electrical paths between die and substrate. The method suits devices in which face-down die attach replaces conventional wire bonding. The process applies to rigid and flexible substrate packaging alike, wherever fine-pitch interconnection is needed.

What do the numbers mean?

Wafer handling1

Wafer Sizes: 8 inch^[1]

Configuration & options3

Manufacturer: Shinkawa^[1]
Model: COF 300^[1]
Description: Flip Chip Bonder^[1]

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of machine is the Shinkawa COF 300?

The Shinkawa COF 300 is a flip chip bonder.^[1]^[2]^[3]^[4]

In which equipment category does the COF 300 belong?

The COF 300 is categorized under packaging and bonding equipment.^[2]

Not publicly documented

The following facts about the COF 300 Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the COF 300 Flip Chip are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the COF 300 Flip Chip are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the COF 300 Flip Chip are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the COF 300 Flip Chip are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the COF 300 Flip Chip is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources

[1]Equipment inventory listing
[2]COF 300 Flip Chip — Shinkawa | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
[3]SHINKAWA COF 300 Flip Chip Bonder for sale — fabsurplus.comfabsurplus.com
[4]SHINKAWA COF-300 Flip Chip Bonder 2 set | 宜庭科技有限公司 Dynamic MOS Technology Co., Ltd. — dynamicmos.comdynamicmos.com