Shinkawa
UTC 200 BI Super II
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Shinkawa UTC 200 BI Super II is a wire bonder.[1]
What it is
The Shinkawa UTC 200 BI Super II is a wire bonder used in semiconductor packaging.[1]
How it works
General reference — not yet source-verifiedWire bonders typically use a capillary tool to feed wire and form connections. The wire is bonded to pads on the die and leads on the package using a combination of heat, pressure, and ultrasonic energy.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is performed after die attach and before encapsulation. The wire bonder connects the die to the package substrate to allow electrical communication.
Applications
General reference — not yet source-verifiedWire bonding is used for packaging a wide variety of semiconductor devices, including integrated circuits, discrete components, and memory chips. Bonding wire materials commonly include gold, copper, and aluminum.
What do the numbers mean?
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the UTC 200 BI Super II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UTC 200 BI Super II are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UTC 200 BI Super II are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 200 BI Super II are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 200 BI Super II are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UTC 200 BI Super II is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Sep 27, 2026.
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