Speedline
FX D 8000 Underfill
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Speedline FX D 8000 is an underfill machine manufactured by Speedline. The Speedline FX D 8000 is categorized as EQP, Dispense, and UF (underfill) equipment.[1]
What it is
How it works
General reference — not yet source-verifiedAn underfill machine dispenses a flowable encapsulant beneath a bonded semiconductor device after attachment to help fill the gap between the device and the substrate.
Equipment of this class typically meters material through a controlled dispense system and places it at the interface that needs fill and reinforcement.
Where it fits in the process flow
General reference — not yet source-verifiedAn underfill machine sits in the assembly flow after the device has been attached to the substrate and before the package is completed.
An underfill step follows bonding operations and supports packaging by preparing the assembly for later finishing steps.
Applications
General reference — not yet source-verifiedAn underfill machine is used in semiconductor packaging for assemblies that need mechanical support and protection at the device-to-substrate interface.
An underfill machine is used with bonded electronic assemblies that require gap filling beneath the mounted device.
What do the numbers mean?
Configuration & options5
- EQP, Dispense, UF,[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the equipment type?
The Speedline FX D 8000 is an underfill machine.[1]
Not publicly documented
The following facts about the FX D 8000 Underfill are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FX D 8000 Underfill are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FX D 8000 Underfill are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FX D 8000 Underfill are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FX D 8000 Underfill are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FX D 8000 Underfill is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]inventory listing
Last updated Oct 7, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
