SPTS

The CPX Pegasus is a deep reactive ion etcher that uses inductively coupled plasma.[9]
The CPX Pegasus uses a source RF generator rated at 6.5 kW and a platen RF generator operating at 13.56 MHz.[1][9]
The CPX Pegasus includes a Brooks MagnaTran 7 robot for wafer transport.[1][9][3]
The CPX Pegasus uses an electrostatic chuck and heating and cooling circuits with house water, deionized water, and silicon oil for temperature control.[9]
An etch tool transfers a patterned film image into an underlying layer after patterning has defined the areas to be removed.
The CPX Pegasus belongs in dry plasma processing for material removal on patterned wafers.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the CPX Pegasus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CPX Pegasus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CPX Pegasus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CPX Pegasus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CPX Pegasus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CPX Pegasus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
General referenceThe Tegal 90 X is an etch system designed for semiconductor fabrication, representing a class of dry plasma etching equipment used to remove material from wafer surfaces with high precision.
Lam Alliance A 6 Exelan HP Dielectric is an etch tool with an 8-inch wafer size.
The Nordson March AP 1000 is a plasma system used for etching, operating at 50 Hz with a CB current of 25 A and an SCCR of 10 kA.
The Nordson March AP 300 is a plasma system with a 300 Watt, 13.56 MHz RF generator and an integrated RF automated tuning network assembly.