Synaps

The SPTS Synaps is an etch module designed for the SPTS Omega fxP system. The Synaps is a chamber-only configuration without a matching network (MF). The module supports wafers of six-inch size.^[1][2][3]

The Synaps chamber creates a low-pressure plasma using a radio-frequency power source. Process gases are introduced into the chamber and dissociated into reactive species that chemically and physically etch the wafer surface. The chamber design includes features for uniform gas distribution and temperature control to ensure consistent etch results.

The Synaps module is used in the etch step of semiconductor fabrication, typically after lithography and before subsequent deposition or cleaning steps. The module removes material from defined areas on the wafer surface to create device features such as trenches, vias, and contact holes.

The Synaps is applied in plasma etching of dielectric and silicon materials in semiconductor device fabrication. Applications include etching of silicon dioxide, silicon nitride, polysilicon, and other thin films used in integrated circuits and microelectromechanical systems.

The module supports fluorine-based and oxygen-based etch chemistries common in front-end-of-line and back-end-of-line processing. The chamber design enables anisotropic and isotropic etch profiles depending on the process recipe.